Chamfer Machines to remove sharp corners became one of our products range in cooperation with Yuko, which is in the business for more than 30 years.
- Grinding target：Glass, Quartz, Crystal, Ceramic (alumina) , Sintered metal (crystal)
- Grinding method：C edge grinding mainly multi diamond（φ60-5、φ70-4、φ70-3）, R edge grinding Pencil edge diamond （φ100、φ150 and etc）
- Grinding size： ＃700M diamond C0.05~0.30 mm ＃500M diamond C0.30~0.50 mm
“Integrated model” with “ICM cleaner” is also available.
Realize Low cost ・ Easy Maintenance .
- Process example ： LD→Grinder→Shower→ （Disc）brush roller→（2 fluid jet / High pressure / MS→）Rinse→Air knife→（IR & Cooling→UV→）ULD
>>> Pairing with each cleaning tools is available. <<<
Work size & Tact time