Imai Seisakusho

Eetcher 1

Etcher‚P

This equipments etches metal foil surface (AL etc).
It roll transfers and etches continuously thin and very fragile material without damage and crimple with our original low tention technique.

 

 

¦Click to enlarge


yCharacteristicsz

Etcher‚PEBasic concept

ySpecificationz

Lane layout 1Lane
Transfer speed 5.0m^min
Material width

MAX 310mm

Material thickness 20ƒÊm`
Processed surface One side or both side
Process flow Unwinder ` Etching ` Cleaning ` Drying ` Winder
Utility

Electric poweri AC200E220V^50E60HZ jA

DI water, City water, Cooling water, Scrubber, Heat exhaust, (Steam)

Equipment size 15miLj ~ 2miWj ~ 2.5miHj ¦Excluding touch panelEincidental facilities

Etcher 2

Etcher‚Q

This equipment transfer thin single substrate such as FPC by Roll to Roll and etches continuously.
Excellent accuracy control of detergent tempearture and pressure.

 

 

¦Click to enlarge


yChracteristicsz

Etcher‚QEBasic concept

ySpecificationz

Lane layout 1Lane
Transfer speed 1.5m^min
Material width

MAX 350mm

Material thickness 50ƒÊm`
surface to etch Only one side
Process flow UnwinderiLoaderj` Laminate ` Etching ` Wet cleaning ` Acid cleaning ` Wet cleaning `
Winderisubstrate peelingj ` Wet cleaning ` Drying ` Substrate stacker
Utility

Electric poweri AC200E220V^50E60HZ jA

DI water, City water, CDA, Cooling water, Scrubber, Heat exhaust, (Steam)

Equipment size 10D0miLj ~ 3.0miWj ~ 3.0miHj ¦excluding touch panelEincidental facilities