Imai Seisakusho

Plating equipments

¦Click to enlarge


yCharacteristicsz

Platiing equipmentEBasic concept

This equipments electroless-plates on "conoductive base" formed in resin film. With our original technic it transfers thin material without damage and crinkle.
Equipment length can be shorten with adopting UPEDOWNEU turn layout.

ySpecificationz

Lane layout 1Lane
Transfer speed 0.5m^min i MAX 1.5m^minj
Material width MAX 600mm
Material thickness 50ƒÊm`
Processed surface One side or both side
Process flow Unwinder`Stripping`Wet cleaning`Water cut`Drying`Winder
Utility Electric poweri AC200E220V^50E60HZ jADI water, City water, Cooling water, Scrubber, Heat exhaust,
(Steam)
Equipment size 15miLj ~ 2miWj ~ 2.5miHj@¦excluding touch panelEincidental facilities